SOURCE: QuickLogic Corporation
SUNNYVALE, CA--(Marketwire - Jun 26, 2012) - QuickLogic Corporation (NASDAQ: QUIK), the leader in low-power Customer Specific Standard Products (CSSPs), is showcasing its CSSP solutions at the 2012 Qualcomm Uplinq Conference in San Diego on June 27 and 28. Attendees will learn how ArcticLink® III VX CSSP solutions can be deployed to bridge Qualcomm's Dragonboard™ MIPI DSI interface to tablet displays with the LVDS interface.
This bridging capability is demonstrated on a daughter card that contains an ArcticLink III VX5 device which also includes QuickLogic's VEE (Visual Enhancement Engine), based on the iridix® core from Apical Limited, and DPO (Display Power Optimizer) technology. The daughter card is designed to connect to Qualcomm's Snapdragon-based Dragonboard and provide an easy way for engineers and architects to evaluate the bridging solution as well as the effect of the VEE and DPO technology on the visual experience and battery life savings.
Snapdragon Experience Zone
Hilton San Diego Bayfront
June 27-28, 2012
Wednesday, June 27: 12:00 p.m. - 7:00 p.m.
Thursday, June 28: 11:00 a.m. - 5:00 p.m.
The QuickLogic reference design includes a daughter card and associated Android system software drivers.
QuickLogic Corporation is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com
QuickLogic and ArcticLink are registered trademarks and the QuickLogic logo is a trademark of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.