SOURCE: Mattson Technology, Inc.
FREMONT, CA--(Marketwire - Aug 14, 2012) - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced semiconductor processing equipment, today announced that it has shipped its paradigmE etch system to a major semiconductor manufacturer. This is the first etch system shipped to this chipmaker, which will utilize the tool for advanced etch applications, including advanced pattern multiplying etches, for the production and development of leading-edge integrated circuits (IC) at the 20-nanometer technology node and below.
New investments in extreme ultra-violet (EUV) are being made to bring lithography technologies back in alignment with Moore's Law, but the deployment of these new technologies will take several years. Multi-pattern etch techniques -- such as dual pattern transfer (DPT), quadruple pattern transfer (QPT) and spacer-defined double patterning (SDDP) -- offer alternatives for IC manufacturers to produce features smaller than the current limits of immersion lithography, at a lower cost than current experimental EVU lithography. However, multi-pattern etching increases the overall etch costs for wafer fabrication facilities.
"One of the biggest challenges chipmakers face as they continue to develop the next technology nodes is how to control the escalating costs of wafer fabrication, and our etch systems are helping our customers bridge that cost gap today," said Rene George, vice president and general manager of Plasma Products Group. "As the industry transitions to multi-pattern etching as a key enabler of advanced device scaling, dry etch plays an increasingly important role in pattern shrinking. The paradigmE's proprietary plasma source enables advanced etch performance, traditionally thought to be achievable only in single wafer vacuum chambers, in our unique two-wafer chamber design. The advantage of leading-edge etch performance, combined with the efficiency of a two-wafer chamber design, lowers our customers' cost-of-ownership by up to 30 percent."
"Our etch products are already utilized in major foundry/logic and memory facilities, and the shipment of the first paradigmE to this latest chipmaker demonstrates Mattson Technology's further expansion into the dry etch market. We look forward to supporting our etch customers in the continued development of advanced patterning and other next-generation applications for 3D transistor and 3D memory array devices. We expect that the paradigmE's leading-edge etch capabilities with industry-leading productivity will translate into production orders from multiple customers to support their 20-nm manufacturing ramps."
About Mattson Technology, Inc.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operate in three primary product sectors: Dry Strip, Rapid Thermal Processing and Etch. Through manufacturing and design innovation, we have produced technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: (800) MATTSON / (510) 657-5900. Internet: www.mattson.com.
"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements of the plans, strategies and objectives of management for future operations. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such forward-looking statements and assumptions. Such risks and uncertainties include, but are not limited to: macroeconomic and geopolitical trends and events; end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.