Vishay Releases Industry's First 30-V Monolithic Power MOSFET and Schottky Diode With Double-Sided Cooling

MALVERN, PA--(Marketwire - September 24, 2008) - Vishay Intertechnology, Inc. (NYSE: VSH) today announced the release of the industry's first 30-V monolithic power MOSFET and Schottky diode to be offered in a package with top and bottom heat dissipation paths for top performance in systems with forced air cooling. Offered in the PolarPAK® package with double-sided cooling, the new SkyFET® SiE726DF device offers increased efficiency for high-current and high-frequency applications.

Optimized for the low-side control switch in synchronous rectification for high-current dc-to-dc converters, VRM applications, graphics cards, and point-of-load in servers and telecom systems, the new SiE726DF offers exceptionally low on-resistance of 0.0024 ohms maximum at a 10-V gate drive (0.0033 ohms maximum at 4.5 V), and can handle current levels 50 % higher than the SO-8 in the same footprint size, without a heatsink. The device provides a typical gate charge of 50 nC, with a low Qgd/Qgs ratio to help prevent shoot-through.

With a Qrr of 30 nC and VSD of 0.37 V -- both of which are more than 50 % lower than that of a standard MOSFET -- the SiE726DF integrated MOSFET and Schottky diode increases efficiency due to less parasitics and reduced power losses linked to the body diode of the MOSFET. As switching frequencies increase, the reduction in power loss becomes even more dramatic. In addition, the elimination of the external Schottky diode allows designers to create smaller, more compact circuit designs while reducing costs.

Link to product datasheet:

http://www.vishay.com/doc?68626 (SiE726DF)

The double-sided cooling provided by the PolarPAK package enables better thermal performance for high-current applications. This allows for operation with a lower junction temperature with a thermal resistance of 1 °C/W top and 1 °C/W bottom. Its leadframe-based, encapsulated design also offers increased protection and reliability, in addition to simplifying manufacturing, since the die is not exposed. The device offers the same layout regardless of die size for easier PCB design, and is 100 % Rg and UIS tested.

Samples and production quantities of the SiE726DF are available now, with lead times of 10 to 12 weeks for larger orders.

Vishay Intertechnology, Inc., a Fortune 1,000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, rectifiers, transistors, and optoelectronics and selected ICs) and passive electronic components (resistors, capacitors, inductors, sensors, and transducers). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, and medical markets. Its product innovations, successful acquisition strategy, and ability to provide "one-stop shop" service have made Vishay a global industry leader. Vishay can be found on the Internet at http://www.vishay.com.

SkyFET and PolarPAK are registered trademarks of Siliconix incorporated