SOURCE: Globalpress Connection
February 28, 2011 12:00 ET
Semiconductor Companies to Unwrap New Products March 28-31 at Globalpress Electronics Summit2011 in Santa Cruz
Summit Is Premier Conference and Meeting Ground for U.S. High-Tech Execs and International Journalists
SANTA CRUZ, CA--(Marketwire - February 28, 2011) - Globalpress Connection (www.globalpresspr.com), a global public-relations agency that brings international media directly to the high-tech industry, announced that a number of semiconductor companies will use the Globalpress Electronics Summit2011 as a forum to unveil new products or to launch their companies to global audiences.
At the 9th annual Globalpress Electronics Summit, to be held from March 28 to 31 at the Chaminade Resort, the following companies intend to make important announcements:
- Akustica, a Pittsburgh-based company that invented digital micro electro-mechanical systems (MEMS) microphones, will introduce its fourth generation of MEMS microphones -- which deliver high-quality voice input to consumer electronics applications -- and its first new product since the company joined the Bosch Group in 2009.
- Fulcrum Microsystems, a venture-backed semiconductor company leveraging its patented high-performance clockless design methodology -- building on research conducted at California Institute of Technology -- is using the March 31 Emerging Day of the Globalpress Summit as an official global coming-out party for the company and its products.
- IDT (Integrated Device Technology), a publicly traded company that combines analog and digital technology to develop system-level innovations that optimize customers' applications and enrich the end-user experience, is taking advantage of the Summit to "introduce IDT's reincarnation as The Analog and Digital Company," according to Dr. Ted Tewksbury, IDT's president and CEO.
- Tensilica, the leader in customizable dataplane processor IP cores, will showcase new processor technology that allowed it to create the world's fastest DSP IP core, which will be used in LTE Advanced applications.
"The Globalpress Electronics Summit has evolved into an important 'see-and-be-seen' event for top U.S. high-tech executives whose companies do business in Europe or Asia," said Irmgard Lafrentz, president of Globalpress Connection. "The Summit lets the executives' network with their peers while forging closer ties to leading international editors, all in a refined, collegial setting -- and for a fraction of the cost and hassle of mounting an international press tour."
About Globalpress Connection
Globalpress Connection is a San Jose, Calif.-based public relations agency that has pioneered high-value methods for bringing international media directly to high-tech companies. Globalpress' annual Summit and a new conference, euroasiaPRESS 1:1, allow U.S. companies throughout the electronics ecosystem to meet in person in Silicon Valley with European and Asian trade and business journalists, avoiding the need to mount international press tours. Globalpress is able to double high-tech companies' international press coverage using one-tenth the budget and one-tenth the time of top executives. As a result, the agency has helped its more than 500 clients reach new customers and partners internationally, build greater trust and confidence in their products, and increase brand awareness in important markets worldwide. More information is available at www.globalpresspr.com.